Nā Mikina Lima Lijiejing 9-'īniha Haʻahaʻa Chloroprene: Ke Kūlana Hou i ka Palekana Maʻemaʻe no ka Hana ʻana o Semiconductor

I ke kua o nā koi "zero-defect" paʻa loa i ka hana semiconductor, ua lilo nā mīkina lima nitrile haʻahaʻa chlorine Lijie 9-'īniha i mea pale pono ʻole i ka hana wafer a me nā pae hoʻopili chip ma muli o ko lākou koena ionic haʻahaʻa loa a me ka hana maʻemaʻe kiʻekiʻe. Ma o ka hana kūikawā, ua kāohi pono ʻia ka nui o ka chlorine o ka mīkina lima ma ≤50ppm—ʻoi aku ka nui ma mua o ke kūlana ʻoihana o 100ppm. Pale pono kēia i nā pilikia corrosion i hoʻokumu ʻia e ka neʻe ʻana o ka ion chloride ma nā ʻili wafer, e hoʻokō ana i nā koi koʻikoʻi o ka hana semiconductor no ka kaohi ʻana i ka haumia microscopic.

I ka wā o nā kaʻina hana lithography, hoʻopilikia pololei ka maʻemaʻe o nā mīkina lima i ka pololei o ka uhi photoresist a me nā hopena hōʻike. Hana ʻia ma nā lumi maʻemaʻe Class 100,000 a ua hoʻokuʻu ʻia i ka wehe ʻana o ka lepo laser, hōʻike kēia huahana i ka hoʻokuʻu ʻana o nā ʻāpana ʻili ma lalo o 0.2 mau ʻāpana/ʻīniha kuea—e hoʻokō ana i nā kūlana lumi maʻemaʻe ISO Class 3. Pale pono kēia i ka hoʻopili ʻana o nā micro-particle i nā ʻili wafer, a laila e hōʻemi ana i nā hemahema lithography. Hāʻawi ka hoʻolālā lōʻihi 9-ʻīniha i ka uhi piha mai ka pulima a i ka pāma. I hui pū ʻia me kahi ʻano cuff elastic, hōʻoia ia i ka maʻalahi o ka hana ʻoiai e pale pono ana i ka hoʻokahe ʻana o ka lepo ma ka wehe ʻana o ka lima, e hoʻokō ana i nā koi koʻikoʻi no nā wahi maʻemaʻe ikaika i nā kaʻina hana lithography.

I ka wā o nā kaʻina hana e pili ana i nā reagents corrosive kiʻekiʻe e like me ke etching a me ka ion implantation, hōʻike kēia mau mīkina lima i ke kūpaʻa kemika koʻikoʻi. Ma hope o ka hoʻāʻo hoʻoluʻu ʻana he 24 hola i nā reagents semiconductor maʻamau e like me ka hydrofluoric acid a me ka phosphoric acid, ʻaʻole lākou e hōʻike i ka pehu a i ʻole ka nahā, me ka helu loli kaumaha ma lalo o 0.8%. Hāʻawi kēia i ka pale lima hilinaʻi no nā mea hoʻohana me ka hoʻopau ʻana i nā pilikia haumia reagent mai ka hōʻino ʻana o ka mīkina lima. Loaʻa i nā manamana lima nā ʻano anti-slip i kālai ʻia me ka laser 0.02mm, e hoʻonui ana i ka friction ma 35% i ka wā e lawelawe ana i nā wafers 12-'īniha a me ka hoʻemi ʻana i ka pilikia o ka paheʻe ʻana o ka wafer ma 60%. Hoʻokō kēia i kahi kaulike ma waena o ka palekana pale a me ke kūpaʻa hana.

I kēia manawa ua hōʻoia ʻia e nā kūlana SEMI F57, ua hoʻolaha ʻia kēia mau mīkina lima i nā laina hana nui ma nā hale hana hoʻokumu e like me SMIC lāua ʻo Hua Hong Semiconductor. Hoʻemi lākou i nā helu ʻōpala wafer i hoʻokumu ʻia e ka hoʻopā lima ma 38%, e hoʻokumu ana iā lākou iho ma ke ʻano he koho kūpono i ka hana semiconductor no ke kaulike ʻana i ka pale o ka lumi maʻemaʻe me ka pono hana.